CVE-2018-13896 (mdm9206_firmware, mdm9607_firmware, mdm9650_firmware, mdm9655_firmware, msm8996au_firmware, qcs404_firmware, qcs605_firmware, qualcomm_215_firmware, sd_410_firmware, sd_412_firmware, sd_425_firmware, sd_427_firmware, sd_429_firmware, sd_430_firmware, sd_435_firmware, sd_439_firmware, sd_450_firmware, sd_625_firmware, sd_632_firmware, sd_636_firmware, sd_670_firmware, sd_710_firmware, sd_712_firmware, sd_820_firmware, sd_820a_firmware, sd_835_firmware, sd_845_firmware, sd_850_firmware, sd_855_firmware, sd_8cx_firmware, sda660_firmware, sdm439_firmware, sdm630_firmware, sdm660_firmware, snapdragon_high_med_2016_firmware, sxr1130_firmware)

XBL_SEC image authentication and other crypto related validations are accessible to a compromised OEM XBL Loader due to missing lock at XBL_SEC stage.. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in MDM9206, MDM9607, MDM9650, MDM9655, MSM8996AU, QCS404, QCS605, Qualcomm 215, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SD 8CX, SDA660, SDM439, SDM630, SDM660, Snapdragon_High_Med_2016, SXR1130

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